Heatsink; Eliptical Pin with clip assembly; 29 x 32.6mm
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEAT SINK ELLIP FIN 29X29MM CLIP
Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 29 x 32.6 mm
| 型号 | 品牌 | 下载 |
|---|---|---|
| 905-29-1-33-2-B-0 | Wakefield Engineering | 下载 |
| 905-6525100 | TI 德州仪器 | 下载 |
| 905-010 | Littelfuse 力特 | 下载 |
| 905-016 | Littelfuse 力特 | 下载 |
| 905-5462001 | TI 德州仪器 | 下载 |
| 905-29-2-33-2-B-0 | Wakefield Engineering | 下载 |
| 905-150-5001 | Amphenol 安费诺 | 下载 |
| 905-138-5002 | Amphenol 安费诺 | 下载 |
| 905-163 | Amphenol 安费诺 | 下载 |
| 905-120-5003 | Amphenol 安费诺 | 下载 |
| 905-125 | Bivar | 下载 |