860-60G

860-60G概述

HEAT TRANS COMPOUND SILICONE

Heat Transfer Compound, 400 V/MIL Dielectric Strength, 2.3 Specific Gravity

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

* MIL-DTL-47113D

860-60G数据文档
型号 品牌 下载
860-60G

MG Chemicals

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860-9MMX55M

3M

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860-10/024

Qualtek

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860-04/002

Qualtek

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860-02/001

Qualtek

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860-06/005

Qualtek

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860-04/014

Qualtek

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860-06/016

Qualtek

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860-06/018

Qualtek

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860-04/004

Qualtek

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860-03/008

Qualtek

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