Heatsink; Fin Pin with clip assembly; 31 x 20.6mm
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEAT SINK PIN FIN 31X31MM CLIP
Allied Electronics:
Heatsink; Fin Pin with clip assembly; 31 x 20.6 mm
| 型号 | 品牌 | 下载 |
|---|---|---|
| 906-31-2-21-2-B-0 | Wakefield Engineering | 下载 |
| 906-31-1-21-2-B-0 | Wakefield Engineering | 下载 |
| 906-31-2-28-2-B-0 | Wakefield Engineering | 下载 |
| 906-122-5000 | Amphenol 安费诺 | 下载 |
| 906-300 | Bivar | 下载 |
| 906-055 | Bivar | 下载 |
| 906-060 | Bivar | 下载 |
| 906-065 | Bivar | 下载 |
| 906-070 | Bivar | 下载 |
| 906-120 | Bivar | 下载 |
| 906-105 | Bivar | 下载 |