0.01Ω ±1% 1W ±300ppm/℃ Φ3.30mm
**Features:
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* Ultra-Low Ohmic Value Series for Current Sensing Applications**
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* Very Low Inductance <1 nH at 1 MHz Test**
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* Miniaturized Dimensions, Better Power to Dimension Ratios**
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* Use of the Highest Quality Standard 96% Alumina Ceramic Core**
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* Manufacturing Process: Wire Winding/Spot Welding — By Computer Numerical Control CNC Machine Tools to Ensure Consistency of Product Quality**
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* Encapsulated by Epoxy Molding Compound**
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* Advanced IC Encapsulation Mold/Die Technologies