散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x19.5mm, 53.3mm Fin Tip
散热片 BGA 铝 - 顶部安装
得捷:
HEAT SINK 30MM X 30MM X 19.5MM
贸泽:
散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x19.5mm, 53.3mm Fin Tip
艾睿:
Heat Sink Passive BGA Spread Clip 3.31°C/W Black Anodized
Verical:
Heat Sink Passive BGA Spread Clip Aluminum 3.31C/W Black Anodized
AMEYA360:
HEAT SINK 30MM X 30MM X 19.5MM
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|---|---|---|
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