SAC0307 HF212 AGS88,5 AF5 500G JAR

MULTICORE / LOCTITE SAC0307 HF212 AGS88,5 AF5 500G JAR Solder Paste, Jar, 226℃, 500g

The from Multicore is a solder paste shows excellent solderability when reflowed in both air and nitrogen. HF 212 is suitable for use with industry standard SAC, high reliability SAC and low silver alloys SAC.

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Passes IC with pre-treatment IPC-TM-650 2.3.34/EN14582

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Fine pitch capability of 0.3mm and abandon time >4hours

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Stencil life >8 hours and Shelf life of 6months at 0°C to 10°C in original container

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Suitable for high speed printing up to 150mm/s

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Colourless residues for easy post reflow inspection

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AGS multicore powder

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Powder particle size distribution from 20µm to 45µm

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Low silver alloy with melting point range from 217°C to 226°C

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500g plastic jars with an air seal insert

The material should be removed from cold storage a minimum of 8 hours before use.