LSM6DS3

iNEMO 惯性模块 IC，STMicroelectronicsLSM9DS0：3D 加速表，3D 陀螺仪，3D 磁力计 LSM6DS0、LSM330DLC：3D 加速表和 3D 陀螺仪 ### 陀螺仪，STMicroelectronics

The is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA up to 1.6 kHz ODR in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3 is available in a plastic land grid array LGA package.

**Key Features**

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Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.

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“Always-on” experience with low power consumption for both accelerometer and gyroscope

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Smart FIFO up to 8 kbyte based on features set

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Compliant with Android K and L

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Hard, soft ironing for external magnetic sensor corrections

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±2/±4/±8/±16 g full scale

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±125/±250/±500/±1000/±2000 dps full scale

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Analog supply voltage: 1.71 V to 3.6 V

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Independent IOs supply 1.62 V

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Compact footprint, 2.5 mm x 3 mm x 0.83 mm

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SPI/I2 C serial interface with main processor data synchronization feature

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Embedded temperature sensor

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ECOPACK® , RoHS and “Green” compliant