WAKEFIELD SOLUTIONS 904-27-1-23-2-B-0 散热器, 用于芯片组, 10.58 °C/W
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEATSINK 27X27X23MM ELLIPTICAL
贸泽:
Heat Sinks CHIPSET HS ELIPTICAL 27mm 22.6mm H B/A
e络盟:
散热器, 用于芯片组, 10.58 °C/W
Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 27 x 22.6 mm
Verical:
Elliptical Fin Heat Sink
Newark:
# WAKEFIELD SOLUTIONS 904-27-1-23-2-B-0 Heat Sink, Square, Chipset, 10.58 °C/W, 22.6 mm, 27 mm, 27 mm
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