Res Thick Film 0805 1Ω 1% 0.125W1/8W ±100ppm/℃ Molded SMD Paper T/R
* Stability ΔR/R = 1 % for 1000 h at 70 ° C * 2 mm pitch packaging option for 0603 size * Pure tin solder contacts on Ni barrier layer provides compatibility with lead Pb-free and lead containing soldering processes * Metal glaze on high quality ceramic * AEC-Q200 qualified
安富利:
Res Thick Film 0805 1 Ohm 1% 1/8W ±100ppm/°C Molded SMD Paper T/R
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