DSP(仅限于 DSP),用于嵌入式 V90 调制解调器解决方案 [不推荐在新型设计中采用 NRND]
The is used to implement a full-featured, high-performance modem technology, intended for use in embedded systems and similar applications. This highly integrated solution implements a complete modem using only two chips: the TMS320C54V90 DSP with on-chip RAM and ROM, and the Si3016 line-side DAA.
The modem can connect to a host system serially RS-232 functionality, or as an 8-bit peripheral to the processor in a host system. The TMS320C54V90 uses a standard Digital Signal Processor DSP and proprietary firmware to perform all the modem signal processing, the V.42/V.42bis compression, and AT commands interpretation for modem control functions.
The TMS320C54V90 also uses the latest silicon DAA technology. This technology does not require a transformer and results in lower cost, lower power, and a smaller area for the DAA function.
For serial interface applications, an integrated UART implements the serial interface with no additional hardware.
V.90, V.34, V.32bis, V.32, V.22bis, V.22, V.23,
V.21 and V.23 reversible Minitel, Bell 212, Bell 103
* V.42 or MNP Class 3 and 4 Error Control and V.42bis Compression
* Caller ID
* Field-Proven Modem Algorithms Give Highest Performance, Reliability, and Compatibility
* Non-Volatile EEPROM Configuration Storage
* Worldwide Telecom Approvals
* Parallel Phone Support Including Parallel Phone Detection
* Parallel Phone Exclusion Relay Control
* Protected Against Surge and Overvoltage on the Telephone Line
* Parallel Host Port Interface Supports a Variety of Industry Standard Busses
* Integral Serial Interface UART
* Autobaud on Serial DTE Interface
* State-of-the-Art Integrated Transformerless Silicon DAA for Phone Line Interconnection
* Applications
* 40K x 16-Bit Dual-Access On-Chip RAM
* 128K x 16-Bit On-Chip ROM
* On-Chip Peripherals
* Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
* On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 JTAG Boundary Scan Logic
* 8.5-ns Single-Cycle Fixed-Point Instruction Execution Time 117.96 MIPS or 17-ns Instruction Execution Time 58.98 MIPS for 3.3-V Power Supply 1.5-V Core
* Available in a 144-Pin Plastic Low-Profile Quad Flatpack LQFP PGE Suffix and a 144-Pin Ball Grid Array BGA GGU Suffix
**Note:** Human Body Model ESD test performance for this product was demonstrated to be ±1.5 kV during product qualification. Industry standard test method used was IEA/JESD22-A114. Adherence to ESD handling precautionary procedures is advised at all times.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
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