DF160R12W2H3F_B11数据手册PDF_DF160R12W2H3F_B11中文资料-锐单商城

DF160R12W2H3F_B11概述

Fast and solder-less assembly is possible using our EasyPACK™ 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3.

Summary of Features:

.: High Speed IGBT H3

.: Low Switching Losses

.: CoolSiC™ Schottky diode 1200V

.: Al2O3 Substrate with Low Thermal Resistance

.: Integrated NTC temperature sensor

.: PressFIT Contact Technology

Benefits:

.: Compact module concept

.: Optimized customer’s development cycle time and cost

.: Configuration flexibility

DF160R12W2H3F_B11详细参数

DF160R12W2H3F_B11数据文档

型号	品牌	下载
DF160R12W2H3F_B11	Infineon 英飞凌	下载
DF162.0-14DP-0.5V86	Hirose Electric 广濑	下载
DF16-30DS-0.5V86	Hirose Electric 广濑	下载
DF16VC60R-7102	Shindengen 新电元	下载
DF160R12W2H3FB11BOMA1	Infineon 英飞凌	下载
DF162.0-30DP-0.5V86	Hirose Electric 广濑	下载
DF162.5-50DP-0.5V86	Hirose Electric 广濑	下载
DF162.0-80DP-0.5V86	Hirose Electric 广濑	下载
DF162.0-40DP-0.5V86	Hirose Electric 广濑	下载
DF16B-20DS-0.5V86	Hirose Electric 广濑	下载
DF16B2.5-60DP-0.5V86	Hirose Electric 广濑	下载