BERGQUIST SP900S-0.009-00-43 热绝缘, Sil-垫 900S, .009", TO-220, 10只, 玻璃纤维, 1.6 W/m.K, 5.5 kV, 0.229 mm, 10 ohm-m, 0.95 °C/W
The is a 0.009 x 4 x 3-inch no adhesive Sil-Pad® high performance thermally conductive Insulation Material which is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures. Applications requiring low component clamping forces include discrete semiconductors TO-220,TO-247 and TO-218 mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.
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