Heatsink; Eliptical Pin with clip assembly; 27 x 32.6mm
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEAT SINK ELLIP FIN 27X27MM CLIP
Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 27 x 32.6 mm
| 型号 | 品牌 | 下载 |
|---|---|---|
| 904-27-1-33-2-B-0 | Wakefield Engineering | 下载 |
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| 904-216-001 | Littelfuse 力特 | 下载 |
| 904-187 | Bivar | 下载 |
| 904-27-2-33-2-B-0 | Wakefield Engineering | 下载 |
| 904-27-2-12-2-B-0 | Wakefield Engineering | 下载 |
| 904-27-2-23-2-B-0 | Wakefield Engineering | 下载 |
| 904-250 | Bivar | 下载 |
| 904-080 | Bivar | 下载 |
| 904-020 | Bivar | 下载 |
| 904-085 | Bivar | 下载 |