WAKEFIELD SOLUTIONS 902-21-2-12-2-B-0 散热器, 用于芯片组, 12.4 °C/W
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEATSINK 21X21X12MM PIN
e络盟:
WAKEFIELD SOLUTIONS 902-21-2-12-2-B-0 散热器, 用于芯片组, 12.4 °C/W
Allied Electronics:
Heatsink; Fin Pin with clip assembly; 21 x 11.6 mm
富昌:
902 系列 Al 6063 黑色 阳极 12 mm H 21 mm 芯片 针翅 散热器
Verical:
902-21-2-12-2-B-0
Newark:
# WAKEFIELD SOLUTIONS 902-21-2-12-2-B-0 Heat Sink, Square, Chipset, 12.4 °C/W, 11.6 mm, 21 mm, 21 mm