SPC5643LFF0MLQ1

SPC5643LFF0MLQ1概述

MCU 32Bit MPC56xx e200 RISC 1024KB Flash 3.3V/5V Automotive 144Pin LQFP Tray

Overview

This document provides electrical specifications, pin assignments, and package diagrams for the MPC5643L series of microcontroller units MCUs. For functional characteristics, refer to the MPC5643L Microcontroller Reference Manual. For use of the MPC5643Lin a fail-safe system according to safety standard IEC 61508, refer to the MPC5643L Safety Application Guide. The MPC5643L series microcontrollers are system-on-chip devices that are built on Power Architecture™ technology and:

• Are 100% user-mode compatible with the classic Power Architecture instruction set

• Contain enhancements that improve the architecture’s fit in embedded applications

• Include additional instruction support for digital signal processing DSP

• Integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital converter, Controller Area Network, and an enhanced modular input-output system

This document describes the features of the family and options available within the family members, and highlights important electrical and physical characteristics of the devices.

MPC5643L Microcontroller

• High-performance e200z4d dual core

   – 32-bit Power Architecture™ Book E CPU

   – Core frequency as high as 120 MHz

   – Dual issue five-stage pipeline core

   – Variable Length Encoding VLE

   – Memory Management Unit MMU

   – 4 KB instruction cache with error detection code

   – Signal processing engine SPE

• Memory available

   – 1 MB Flash memory with ECC

   – Built-in RWW capabilities for EEPROM emulation

   – As much as 128 KB on-chip RAM with ECC

• SIL3/ASILD innovative safety concept: LockStep mode and Fail-safe protection

   – Sphere of replication SoR for key components such as CPU core, DMA, crossbar switch

   – Fault collection and control unit FCCU

   – Redundancy control and checker unit RCCU on outputs of the SoR connected to FCCU

   – Boot-time Built-In Self-Test for Memory MBIST and Logic LBIST triggered by hardware

   – Boot-time Built-In Self-Test for ADC and flash memory triggered by software

   – Replicated safety enhanced watchdog

   – Replicated junction temperature sensor

   – Non-maskable interrupt NMI

   – 16-region memory protection unit MPU

   – Clock monitoring units CMU

   – Power management unit PMU

   – Cyclic redundancy check CRC unit

• Decoupled Parallel mode for high performance use of replicated cores

• Nexus Class 3+ interface

• Interrupts

   – Replicated 16-priority controller

   – Replicated 16-channel eDMA controller

• GPIOs individually programmable as input, output or

special function

• Three 6-channel general-purpose eTimer units

• Two FlexPWM units

   – Four 16-bit channels per module

• Communications interfaces

   – Two LINFlex channels

   – Three DSPI channels with automatic chip select generation

   – Two FlexCAN interfaces 2.0B Active with 32 message objects – FlexRay module V2.1 with dual channel, up to 64 message objects and speed as fast as 10 Mbit/s

• Two 12-bit analog-to-digital converters ADCs

   – 16 input channels

   – Programmable cross triggering unit CTU to synchronize ADCs conversion with timer and PWM

• Sine wave generator D/A with low pass filter

• On-chip CAN/UART/FlexRay Bootstrap loader

• Single 3.0 V to 3.6 V voltage supply

• Ambient temperature range –40 °C to 125 °C

• Junction temperature range –40 °C to 150 °C

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