MH10568

MULTICOMP  MH10568  连接器, D sub, 堆叠式, Metal D Sub Tin & Dimple系列, DA, 插头, 15 触点, 钢主体, IDC / IDT

The Metal D Sub Tin & Dimple series IDC standard D-sub Connector with tin and dimple shells. It has copper alloy contacts with 1.5 micron tin and 0.2 micron gold plating and glass filled polyester insulator, stamped tin plated steel shell.

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Black insulators and IDC crimp back shell

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Available with or without 4-40 UNC threads

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Design allows use with standard back shells

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1.5A Current rating

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5000MR Insulation resistance

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<10mR Contact resistance

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-55 to 125°C Operating temperature