BOURNS B1250T 电信保险丝, 1.25A
Telefuse SMD Power Cross Protection Fuse
For use in telecommunication circuit applications requiring low current protection
with high surge tolerance
Overcurrent protection to Telcordia GR-1089-CORE Issue 4 only & UL 1950/60950
### 表面安装技术
表面安装熔丝适用于低电压应用,可大大节省空间(和时间)。 FF 类型最适用于保护高值硅 IC,例如,报警系统、音频/视频设备、计算机板、便携式电话、电源和医疗仪器等等
欧时:
### Telefuse SMD Power Cross Protection FuseFor use in telecommunication circuit applications requiring low current protection with high surge tolerance Overcurrent protection to Telcordia GR-1089-CORE Issue 4 B1250T only & UL 1950/60950 ### 表面安装技术_超微型熔丝架### 表面安装技术表面安装熔丝适用于低电压应用,可大大节省空间(和时间)。 FF 类型最适用于保护高值硅 IC,例如,报警系统、音频/视频设备、计算机板、便携式电话、电源和医疗仪器等等
艾睿:
Fuse Chip 1.25A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R
Allied Electronics:
TELEFUSE, SMD POWER, 1.25A, 600 VRMS
Chip1Stop:
Fuse Chip 1.25A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R
Verical:
Fuse Chip 1.25A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R
Newark:
# BOURNS B1250T Fuse, Surface Mount, Telefuse Series, 1.25 A, 600 VAC, Slow Blow, SMD
MASTER:
Fuse Chip 1.25A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R UL
Electro Sonic:
Fuse Chip 1.25A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R UL
型号 | 品牌 | 下载 |
---|---|---|
B1250T | Bourns J.W. Miller 伯恩斯 | 下载 |
B125D | Diotec Semiconductor | 下载 |
B125C1500G-E4/51 | Vishay Semiconductor 威世 | 下载 |
B125C1000G-E4/51 | Vishay Semiconductor 威世 | 下载 |
B125C800G-E4/51 | Vishay Semiconductor 威世 | 下载 |
B125S2A | Diotec Semiconductor | 下载 |
B125S15A | Diotec Semiconductor | 下载 |
B125R | Diotec Semiconductor | 下载 |
B125C1500A | Diotec Semiconductor | 下载 |
B125S | Diotec Semiconductor | 下载 |
B125S2A-SLIM | Diotec Semiconductor | 下载 |