WAKEFIELD SOLUTIONS 904-27-2-12-2-B-0 散热器, 用于芯片组, 11.38 °C/W
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEATSINK 27X27X12MM PIN
贸泽:
Heat Sinks CHIPSET H/S PIN FIN 27mm 11.6mm H B/A
e络盟:
散热器, 用于芯片组, 11.38 °C/W
Allied Electronics:
Heatsink; Fin Pin with clip assembly; 27 x 11.6 mm
Verical:
904-27-2-12-2-B-0
Newark:
# WAKEFIELD SOLUTIONS 904-27-2-12-2-B-0 Heat Sink, Square, Chipset, 11.38 °C/W, 11.6 mm, 27 mm, 27 mm
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