658 系列 27.9 x 27.9 x 6.4 mm 5° C/W 热阻 全方向 散热片
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™
得捷:
HEATSINK CPU 28MM SQ BLK
贸泽:
散热片 HEATSINK
Allied Electronics:
Heatsink; Omnidirectional; 27mm; 6.4mm; 5C/W
富昌:
658 Series 27.9 x 27.9 x 6.4 mm 5° C/W Resistance Omnidirectional Heat Sink
Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
| 型号 | 品牌 | 下载 |
|---|---|---|
| 658-25AB | Wakefield Engineering | 下载 |
| 658-60ABT4E | Wakefield Engineering | 下载 |
| 658-35ABT4E | Wakefield Engineering | 下载 |
| 658-45ABT3 | Wakefield Engineering | 下载 |
| 658-45ABT1E | Wakefield Engineering | 下载 |
| 658-45ABT5 | Wakefield Engineering | 下载 |
| 658-60ABT6 | Wakefield Engineering | 下载 |
| 658-25ABT5 | Wakefield Engineering | 下载 |
| 658-35ABT5 | Wakefield Engineering | 下载 |
| 658-35ABT3 | Wakefield Engineering | 下载 |
| 658-25ABT2 | Wakefield Engineering | 下载 |