F3L50R06W1E3_B11

EasyPACK模块海沟/ Fieldstopp IGBT3和发射极控制二极管3和压接/ NTC EasyPACK module with Trench/Fieldstopp IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC

Summary of Features:

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Low inductive design

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Low Switching Losses

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Low VCEsat

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Al2O3 Substrate with Low Thermal Resistance

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Compact Design

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PressFIT Contract Technology

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Rugged mounting due to integrated mounting clamps

Benefits:

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Compact module concept

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Optimized customer’s development cycle time and cost

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Configuration flexibility