90ISC HF212 AGS 88,5 AF5 500G JAR

MULTICORE / LOCTITE 90ISC HF212 AGS 88,5 AF5 500G JAR Solder Paste, Tub, 218℃, 500g

The is a Solder Paste available for stencil printing with Type 3 and Type 4 powder. LOCTITE HF 212 solder paste is a halogen-free no intended added halogen in formulation, no clean, low voiding Pb-free solder paste. LOCTITE HF 212 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn. LOCTITE HF 212 is suitable for use with industry standard SAC, high reliability SAC and low silver alloys SAC.

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Halogen-free flux, passes IC with pre-treatment IPC-TM-650 2.3.34/EN14582

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Halogen-free flux classification, ROL0 to ANSI/J-STD-004 Rev. B

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Printing, fine pitch capability 0.3mm, stencil life >8 hours and abandon time >4 hours

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Printing, Suitable for high speed printing up to 150mm/s

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Reflow, solderable on challenging surface finishes CuNiZn and Copper OSP

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Colourless residues for easy post-reflow inspection