624-60AB

624-60AB概述

WAKEFIELD SOLUTIONS  624-60AB  散热器, BGA/LED, 21 X 15.2MM

The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks DVD and global positioning systems GPS.


得捷:
HEATSINK FOR 21MM BGA


贸泽:
Heat Sinks HEATSINK BGA


e络盟:
散热器, BGA/LED, 21 X 15.2MM


Allied Electronics:
Heatsink; Omnidirectional; 0.598 in.; 15.2mm; Black Anodized


Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Verical:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Newark:
# WAKEFIELD SOLUTIONS  624-60AB  Heat Sink, Square, Black Anodized, For Ball Grid Arrays, Penguin Cooler, Pin Fin Clip-On, BGA


MASTER:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


624-60AB数据文档
型号 品牌 下载
624-60AB

Wakefield Engineering

下载
624-25ABT4E

Wakefield Engineering

下载
624-35ABT4E

Wakefield Engineering

下载
624-35ABT5

Wakefield Engineering

下载
624-60ABT4E

Wakefield Engineering

下载
624-25ABT1E

Wakefield Engineering

下载
624-60ABT5

Wakefield Engineering

下载
624-45AB-T4E

Wakefield Engineering

下载
624-45AB

Wakefield Engineering

下载
624-25ABT3

Wakefield Engineering

下载
624-45ABT3

Wakefield Engineering

下载

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