IPN70R600P7SATMA1

IPN70R600P7SATMA1 编带

Description:

CoolMOS™ P7 is designed to address typical challenges in the low power SMPS market, by offering excellent performance and ease-of-use, enabling improved form factors and price competitiveness. The SOT-223 package is a cost effective one-to-one drop-in alternative to DPAK that also enables footprint reduction in some designs. It can be placed on a typical DPAK footprint and shows comparable thermal performance. This combination makes CoolMOS™ P7 in SOT-223 a perfect fit for its target applications.

700V and 800V CoolMOS™ P7 are optimized for flyback topologies. 600V CoolMOS™ P7 is suitable for hard as well as so switching topologies Flyback, PFC and LLC.

Summary of Features:

**Best-fit performance superjunction technology**

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Enabling lower MOSFET chip temperature

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Leading to higher e iciency comparedto previous technologies

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Allowing improved form factors and slim designs

**Cost-effective package solution**

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Drop-in replacement for DPAK atcompetitive cost

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Space savings in designs with lowpower dissipation; enabling smaller form factors

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Comparable thermal behavior to DPAK

**Best-in-class price/performance ratio**

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Attractive price position for high performance technology