M36W832TE70ZA1S和RD38F1010C0ZTL0

对比图 P4CE10F17C6N中文资料P4CE10F17C6N中文资料P4CE10F17C6N中文资料

型号 M36W832TE70ZA1S RD38F1010C0ZTL0 M36W216BI70ZA6

描述 32兆位的2Mb X16 ,引导块闪存和8兆位512KB SRAM X16 ,多重内存产品 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product32Mbit, 3V advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsSPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8MM, 0.8MM PITCH, LFBGA-66

数据手册 ---

制造商 ST Microelectronics (意法半导体) Intel (英特尔) ST Microelectronics (意法半导体)

分类

基础参数对比

封装 LFBGA LFBGA LFBGA

封装 LFBGA LFBGA LFBGA

产品生命周期 Unknown Obsolete Unknown

RoHS标准 - - RoHS Compliant

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