对比图
型号 72T36135ML6BBG IDT72T36135ML6BBG IDT72T36135ML6BBGI
描述 FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19MM, 1MM PITCH, GREEN, PLASTIC, BGA-2402.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 362.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 36
数据手册 ---
制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)
分类
封装 BGA BGA BGA
安装方式 Surface Mount - -
封装 BGA BGA BGA
产品生命周期 Unknown Active Active
RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant
含铅标准 Lead Free Lead Free Lead Free
ECCN代码 - EAR99 -