对比图
型号 68602-116HLF TSW-108-22-G-D HTSW-108-13-T-D
描述 AMPHENOL FCI 68602-116HLF Board-To-Board Connector, 2.54mm, 16Contacts, Header, BergStik 68602 Series, Through Hole, 2RowsSAMTEC TSW-108-22G-D Board-To-Board Connector, 2.54mm, 16Contacts, Header, TSW Series, Through Hole, 2RowsSAMTEC HTSW-108-13-T-D Board-To-Board Connector, 2.54mm, 16Contacts, Header, HTSW Series, Through Hole, 2Rows
数据手册 ---
制造商 Amphenol (安费诺) Samtec (申泰电子) Samtec (申泰电子)
分类 板对板连接器板对板连接器板对板连接器
安装方式 Through Hole Through Hole Through Hole
引脚间距 - 2.54 mm 2.54 mm
触点数 16 16 16
极性 Male Male Male
触点电镀 - Gold Tin
排数 2 2 2
额定电流(Max) - 6.3A/触头 -
工作温度(Max) - 125 ℃ -
工作温度(Min) - -55 ℃ -
额定电压(Max) - 550 VAC -
引脚间距 - 2.54 mm 2.54 mm
高度 - 8.38 mm -
触点材质 Phosphor Bronze Phosphor Bronze Phosphor Bronze
RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant
REACH SVHC标准 - No SVHC No SVHC
REACH SVHC版本 2015/06/15 2015/06/15 2015/06/15
包装方式 - Bulk -