LMUN2211LT1G
集电极-基极反向击穿电压VBRCBO Collector-Base VoltageVCBO| 50V \---|--- 集电极-发射极反向击穿电压VBRCEO Collector-Emitter VoltageVCEO| 50V 集电极连续输出电流IC Collector CurrentIC| 100mA/0.1A 基极输入电阻R1 Input ResistanceR1| 10KΩ/Ohm 基极-发射极输入电阻R2 Base-Emitter ResistanceR2| 10KΩ/Ohm 电阻比R1/R2 Resistance Ratio| 1 直流电流增益hFE DC Current GainhFE| 35-60 截止频率fT Transtion FrequencyfT| 耗散功率Pc Power Dissipation| 0.25W /250mW Description & Applications| Features • Simplifies Circuit Design • Reduces Board Space and Component Count • The SOT-23 package can be soldered using wave or reflow. The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die. • Available in 8 mm embossed tape and reel. Use the Device Number to order the 7 inch/3000 unit reel. Replace “T1” with “T3” in the Device Number to order the13 inch/10,000 unit reel. 描述与应用| 特性 •简化电路设计 •缩小板级空间和元件数量 •SOT-23封装，可以使用波或回流焊接。修改后的鸥翅引线在焊接热应力吸收消除模具损坏的可能性。 •可在8 mm压纹带和卷轴。使用的设备 号码责令7 inch/3000的单位卷轴。替换“T1” “T3”的设备号命令the13 inch/10，000单位卷轴。