Breadboard; Solderless; Polyoxymethylene; 150deg; 830 tie points; 2.1 x 6.5in.
无焊剂试验电路板 端子条(无框架) 6.50" x 2.14"(165.1mm x 54.4mm)
得捷:
BREADBOARD HIGH TEMP 6.50X2.14"
艾睿:
Polyoxymethylene 830 Tie Point Breadboard
Allied Electronics:
Breadboard; Solderless; Polyoxymethylene; 150 deg; 830 tie points; 2.1 x 6.5 in.