TLV314IDBVT

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TLV314IDBVT概述

TLV314IDBVT 编带

The TLV314 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings RRIO, low quiescent current 150 µA typically at 5 V combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. Additionally, the TLV314 family architecture achieves a low input bias current of 1 pA, allowing for applications with MΩ source impedances.

The robust design of the TLV314 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300 pF, an integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge ESD protection 4-kV HBM.

These devices are optimized for low-voltage operation as low as 1.8 V ±0.9 V and up to 5.5 V ±2.75 V, and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314 single is available in both 5-pin SC70 and SOT-23 packages. The TLV2314 dual is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314 is offered in a 14-pin TSSOP package.

TLV314IDBVT中文资料参数规格
技术参数

供电电流 150 µA

电路数 1

针脚数 5

共模抑制比 72 dB

输入补偿漂移 2.00 µV/K

带宽 3 MHz

转换速率 1.50 V/μs

增益频宽积 3 MHz

输入补偿电压 750 µV

输入偏置电流 1 pA

工作温度Max 125 ℃

工作温度Min -40 ℃

共模抑制比Min 72 dB

封装参数

安装方式 Surface Mount

引脚数 5

封装 SOT-23-5

外形尺寸

封装 SOT-23-5

物理参数

工作温度 -40℃ ~ 125℃

其他

产品生命周期 Active

包装方式 Cut Tape CT

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC版本 2015/12/17

数据手册

TLV314IDBVT引脚图与封装图
TLV314IDBVT引脚图
TLV314IDBVT封装图
TLV314IDBVT封装焊盘图
在线购买TLV314IDBVT
型号: TLV314IDBVT
制造商: TI 德州仪器
描述:TLV314IDBVT 编带
替代型号TLV314IDBVT
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