511-12U概述
散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm
散热片 电源模块 铝 - 顶部安装，挤制
得捷:
HEATSINK FOR PWR MOD/IGBT/RELAY
贸泽:
散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm
Verical:
Heat Sink Passive 0.045C/W
MASTER:
Heat Sink Passive 0.045°C/W
Online Components:
Heat Sink Passive 0.045°C/W
Electro Sonic:
Heat Sink Passive 0.045°C/W
在线购买511-12U
型号： 511-12U
制造商：
Wakefield Engineering
描述：散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm