IGBT 模块 PP, IHM I, XHP 1,7KV
Summary of Features:
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Extended Operation Temperature T vjop= 175°C
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Output current increased by more than 25% in the same footprint
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Copper Bonds for high current carrying capabilities
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Sintering of chips for highest power cycling capabilities
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Total losses reduced by up to 20%
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Package with CTI > 400
Benefits:
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Increase in Power Density by up to 25%
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Up to 10 times longer lifetime
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Less cooling effort for same output power
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Enables higher system overload conditions