IS61NLP102418B-250B3LI-TR

IS61NLP102418B-250B3LI-TR图片1
IS61NLP102418B-250B3LI-TR概述

SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,250MHz,3.3V/2.5V - I/O,165 Ball BGA, RoHS

* 100 percent bus utilization * No wait cycles between Read and Write * Internal self-timed write cycle * Individual Byte Write Control * Single R/W Read/Write control pin * Clock controlled, registered address, data and control * Interleaved or linear burst sequence control using MODE input * Three chip enables for simple depth expansion and address pipelining * Power Down mode * Common data inputs and data outputs * /CKE pin to enable clock and suspend operation * JEDEC 100-pin QFP, 165-ball BGA and 119- ball BGA packages * Power supply * Vdd 3.3V ± 5%, Vddq 3.3V/2.5V ± 5% * JTAG Boundary Scan for BGA packages * Commercial, Industrial and Automotive x36 temperature support * Lead-free available.

IS61NLP102418B-250B3LI-TR中文资料参数规格
技术参数

位数 18

存取时间 3 ns

存取时间Max 2.5 ns

工作温度Max 70 ℃

工作温度Min 0 ℃

电源电压 3.135V ~ 3.465V

封装参数

安装方式 Surface Mount

引脚数 165

封装 TBGA-165

外形尺寸

高度 0.79 mm

封装 TBGA-165

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

数据手册

在线购买IS61NLP102418B-250B3LI-TR
型号: IS61NLP102418B-250B3LI-TR
制造商: Integrated Silicon SolutionISSI
描述:SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,250MHz,3.3V/2.5V - I/O,165 Ball BGA, RoHS

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