Breadboard; Solderless; Polyoxymethylene; 150deg; 460 tie points; 2.1 x 3.3in.
无焊剂试验电路板 端子条（无框架） 3.30" x 2.14"（83.8mm x 54.4mm）
得捷:
BREADBOARD HIGH TEMP 3.30X2.14"
贸泽:
PCBs & Breadboards 460 TIE POINTS POM 2.1"X3.3"
艾睿:
High Temperature 400 Tie Point Breadboard
Allied Electronics:
Breadboard; Solderless; Polyoxymethylene; 150 deg; 460 tie points; 2.1 x 3.3 in.
| 型号 | 品牌 | 下载 |
|---|---|---|
| TW-E40-510-P | Twin Industries | 下载 |
| TW-E40-510 | Twin Industries | 下载 |
| TW-E012-000 | Twin Industries | 下载 |
| TW-E41-102B | Twin Industries | 下载 |
| TW-E41-1020 | Twin Industries | 下载 |
| TW-E41-1060 | Twin Industries | 下载 |
| TW-E40-1020-P | Twin Industries | 下载 |
| TW-E41-T2 | Twin Industries | 下载 |
| TW-E41-T1 | Twin Industries | 下载 |
| TW-E40-1020 | Twin Industries | 下载 |
| TW-E40-510 | 3M | 下载 |