Fast Acting 1206 3216 63VDC / 32VAC 2A Chip Fuse Surface Mount
Subminiature Surface Mount Fuses.
* Bussmann SMT Chip Fuses utilize metal film and ultrasonic wire bond technologies for superior fusing action and enhanced reliability.
* Fast acting fuse: Will carry 100% of rated current for a minimum of 4 hours, and will open within 5 seconds at 250% of rated current 250mA-3A.
* The 4~6.5A fuses will open within 1 second at 350% of rated current.
艾睿:
Fuse Chip Fast Acting 2A 32V SMD Solder Pad 1206 T/R
Chip1Stop:
Fuse Chip Fast Acting 2A 32V SMD Solder Pad 3.2 x 1.6 mm T/R
| 型号 | 品牌 | 下载 |
|---|---|---|
| TR/3216FF2-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF1.25-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF4.5-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF30-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF25-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF375-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216LV375-R | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF-1A | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF-3A | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF-1.5A | Cooper Bussmann 库柏 | 下载 |
| TR/3216FF2R | Cooper Bussmann 库柏 | 下载 |