光电传感器, EX-Z 系列, 超小型, 投射光, 500 mm, NPN, 有光开启, 前端感应
The is part of the EX-Z series, which utilises new semiconductor packaging technology that does not use wire bonding to produce one of the thinnest packages available. The small unit size allows installation of sensors in a narrow space where only a conventional fibre sensor head could be installed before. The built-in amplifier also saves on installation space