散热片 Chipset Heatsink with Clip, Elliptical, 35mm Chip Size, 14.6mm Height, Aluminum, Black Anodized
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEAT SINK ELLIP FIN 35X35MM CLIP
贸泽:
散热片 Chipset Heatsink with Clip, Elliptical, 35mm Chip Size, 14.6mm Height, Aluminum, Black Anodized
Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 35 x 14.6 mm
| 型号 | 品牌 | 下载 |
|---|---|---|
| 908-35-1-15-2-B-0 | Wakefield Engineering | 下载 |
| 908-43001 | Amphenol 安费诺 | 下载 |
| 908-H003M | Duratool | 下载 |
| 908-41300 | Amphenol 安费诺 | 下载 |
| 908-NM43200 | Amphenol 安费诺 | 下载 |
| 908-NM24100 | Amphenol 安费诺 | 下载 |
| 908-501B | Duratool | 下载 |
| 908-102-F | Duratool | 下载 |
| 908-35-1-12-2-B-0 | Wakefield Engineering | 下载 |
| 908-22101 | Amphenol 安费诺 | 下载 |
| 908-100 | Bivar | 下载 |