0.25Ω ±1% 0.5W1/2W ±90ppm/℃ Φ2.54mm
**Features:
**
* Operating Temperature Range: –50°C to +150°C
* Designed to Meet MIL-R-26F, MIL-STD-202 Standard Requirements
* Manufacturing Process: Wire Winding/Spot Welding — by Computer Numerical Control CNC Machine Tools to Ensure Consistency of Product Quality
* Encapsulated by Epoxy Molding Compound
* Advanced IC Encapsulation Mold/Die Technologies
得捷:
RES 0.25 OHM 1/2W 1% AXIAL
Allied Electronics:
0.5W MINI MOLDE .025 OHM 1% NI