DF200R12W1H3FB11BOMA1数据手册PDF_DF200R12W1H3FB11BOMA1中文资料-锐单商城

DF200R12W1H3FB11BOMA1概述

Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.

Summary of Features:

.: High Speed IGBT H3

.: Low Switching Losses

.: CoolSiC™ Schottky diode 1200V

.: Fast Silicon diode 1200V

.: Al2O3 Substrate with Low Thermal Resistance

.: Integrated NTC temperature sensor

.: PressFIT Contact Technology

Benefits:

.: Compact module concept

.: Optimized customer’s development cycle time and cost

.: Configuration flexibility

DF200R12W1H3FB11BOMA1详细参数

DF200R12W1H3FB11BOMA1数据文档

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