200001002

SERVISOL 200001002 HEAT SINK COMPOUND, NONE SILICONE, 2ML

The is a 2ml Non-silicone Heat Sink Compound recommend for use on electrical and electronic components that require improved thermal conductivity or the efficient dissipation of heat. It will not cause problems associated with the use of silicone such as high contact resistance and soldering difficulties. It can be used on diodes, transistors, heat sinks, semi-conductors, thermostats, power resistors and radiators. It is presented in a handy to use syringe format cover a wide variety of applications. This syringe allows pin-point application and minimises wasteful over-application.

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Pin point application

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Rapid heat dissipation

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Synthetic base oil

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-50 to 130°C Temperature range

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4.2 Permittivity

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0.9W/mK Thermal conductivity

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42kv/mm Dielectric strength

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2.04 Specific gravity