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Stacking Height Guide for Parallel Board-to-Board Applications

Fine Pitch SMT Stacking Connectors Parallel Board-to-Board

Tyco Electronics 0.8mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today’s electronic industry requirements for high density packaging.

It is possible to save more than 50% of the required board space when compared to conventional 1.27 [.050] centerline connectors.

Product Facts

■ For parallel board stacking applications

■ High density packaging on 0.8 [.031] centerline spacing

■ Available sizes from 40 to 200 positions in 20 position increments

■ Board stacking heights available from 5 [.197] to 16 [.630] in 1 [.039] increments

■ Bellows type spring contacts are resistant to scooping and stubbing during mating and unmating

■ Positioning bosses for proper on-board orientation

■ Available packaged on“tape-and-reel” for automatic placement per EIA standards

■ Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476