AMPLIMITE .050 Hardware/Backshells/Conn
Backshell Kit 75° Nickel Over Copper Zinc
Product Highlights
Hardware
Hardware Type = Backshell Kit
Number of Positions = 80
Cable Insulation Diameter = 10.67 mm
With Mating Connector Lock
Search Keywords:
AMPLIMITE, Subminiature D, high density, wire to board, board to board, cable to board, cable to cable, box to box, cabled connectors, d-sub, d sub, dsub
得捷:
CONN BACKSHELL 80POS 75DEG SHLD
Chip1Stop:
Backshell Kit 75° Nickel Over Copper Zinc
Verical:
Backshell Kit 75° Nickel Over Copper Zinc
MASTER:
Backshell Kit 75° Nickel Over Copper Zinc
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AMPLIMITE .050 Hardware/Backshells/Conn
Online Components:
Backshell Kit 75° Nickel Over Copper Zinc
Electro Sonic:
Backshell Kit 75° Nickel Over Copper Zinc
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