WAKEFIELD SOLUTIONS 910-40-2-23-2-B-0 散热器, 用于芯片组, 7.63 °C/W
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEATSINK 40X40X23MM PIN
e络盟:
散热器, 芯片组, 7.63 度 C/W
Allied Electronics:
Heatsink; Fin Pin with clip assembly; 40 x 22.6 mm
Verical:
PIN FIN HEAT SINK
Newark:
# WAKEFIELD SOLUTIONS 910-40-2-23-2-B-0 Heat Sink, Square, Chipset, 7.63 °C/W, 22.6 mm, 40 mm, 40 mm