150Ω ±1% 1W ±20ppm/℃ Φ3.30mm
**Features:
**
* Operating Temperature Range: –50°C to +150°C
* Designed to Meet MIL-R-26F, MIL-STD-202 Standard Requirements
* Manufacturing Process: Wire Winding/Spot Welding — by Computer Numerical Control CNC Machine Tools to Ensure Consistency of Product Quality
* Encapsulated by Epoxy Molding Compound
* Advanced IC Encapsulation Mold/Die Technologies
得捷:
RES 150 OHM 1W 1% AXIAL
Allied Electronics:
1W MINI MOLDED 150 OHM 1% NI