高抗高温和潮湿 High resistance to heat and humidity
** General Specifications
Temperature Rise:** Storage Temperature:** –40°C to +100°C. ** CM16, CM25, CM32: Resistance to Soldering Heat:** 260°C, 5 seconds. ** CM45: Resistance to Soldering Heat:** 245°C, 5 seconds.
** Features**
* High Resistance to Heat and Humidity
* Resistance to Mechanical Shock and Pressure
* Accurate Dimensions for Automatic Surface Mounting
* Wide Inductance Range 1.0 nH to 1000 μH
** Applications**
* Mobile Phones
* Cellular Phones
* CTV, VCR, HIC, FDD
| 型号 | 品牌 | 下载 |
|---|---|---|
| CM453232-2R7KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM4515-000 | TE Connectivity 泰科 | 下载 |
| CM453232-2R2KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-330KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-331KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-680KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-470KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-681KL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-102JL | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-R10ML | Bourns J.W. Miller 伯恩斯 | 下载 |
| CM453232-R22ML | Bourns J.W. Miller 伯恩斯 | 下载 |