TMS320C6418ZTS600

TMS320C6418ZTS600概述

定点数字定点数字 Fixed-Point Digital Fixed-Point Digital

* High-Performance Fixed-Point Digital Signal Processor TMS320C6418 * Commercial Temperature Device * 1.67-ns Instruction Cycle Time * 600-MHz Clock Rate * 4800 MIPS * Extended Temperature Device * 2-ns Instruction Cycle Time * 500-MHz Clock Rate * 4000 MIPS * Eight 32-Bit Instructions/Cycle * Fully Software-Compatible With C64x™ * Veloci.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word VLIW TMS320C64x™ DSP Core * Eight Highly Independent Functional Units With VelociTI.2™ Extensions: * Six ALUs 32-/40-Bit, Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle * Two Multipliers Support Four 16 x 16-Bit Multiplies 32-Bit Results per Clock Cycle or Eight 8 x 8-Bit Multiplies 16-Bit Results per Clock Cycle * Load-Store Architecture With Non-Aligned Support * 64 32-Bit General-Purpose Registers * Instruction Packing Reduces Code Size * All Instructions Conditional * Instruction Set Features * Byte-Addressable 8-/16-/32-/64-Bit Data * 8-Bit Overflow Protection * Bit-Field Extract, Set, Clear * Normalization, Saturation, Bit-Counting * VelociTI.2™ Increased Orthogonality * VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word VLIW TMS320C64x™ DSP Core * Viterbi Decoder Coprocessor VCP * Supports Over 500 7.95-Kbps AMR * Programmable Code Parameters * L1/L2 Memory Architecture * 128K-Bit 16K-Byte L1P Program Cache Direct Mapped * 128K-Bit 16K-Byte L1D Data Cache 2-Way Set-Associative * 4M-Bit 512K-Byte L2 Unified Mapped RAM/Cache Flexible RAM/Cache Allocation * Endianess: Little Endian, Big Endian * 32-Bit External Memory Interface EMIF * Glueless Interface to Asynchronous Memories SRAM and EPROM and Synchronous Memories SDRAM, SBSRAM, ZBT SRAM, and FIFO * 512M-Byte Total Addressable External Memory Space * Enhanced Direct-Memory-Access EDMA Controller 64 Independent Channels * Host-Port Interface HPI [32-/16-Bit] * Two Multichannel Audio Serial Ports McASPs - with Six Serial Data Pins each * Two Inter-Integrated Circuit I2C Buses * Additional GPIO Capability * Two Multichannel Buffered Serial Ports * Three 32-Bit General-Purpose Timers * Sixteen General-Purpose I/O GPIO Pins * Flexible PLL Clock Generator * On-Chip Fundamental Oscillator * IEEE-1149.1 JTAG Boundary-Scan-Compatible * 288-Pin Ball Grid Array BGA Package GTS and ZTS Suffixes, 1.0-mm Ball Pitch * 0.13-µm/6-Level Cu Metal Process CMOS * 3.3-V I/Os, 1.4-V Internal -600 * 3.3-V I/Os, 1.2-V Internal A-500

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