对比图
型号 72T18125L5BBI IDT72T18125L4-4BB 72T18125L10BB
描述 FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA2.5 VOLT HIGH -SPEED TeraSync FIFO的18位/ 9位配置 2.5 VOLT HIGH-SPEED TeraSync FIFO 18-BIT/9-BIT CONFIGURATIONSFIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA
数据手册 ---
制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)
分类 FIFOFIFOFIFO
安装方式 Surface Mount Surface Mount Surface Mount
引脚数 240 - 240
封装 BGA-240 BGA BGA-240
存取时间 5 ns - 14ns, 4.5ns
工作温度(Max) 85 ℃ - -
工作温度(Min) -40 ℃ - -
电源电压 2.375V ~ 2.625V - 2.375V ~ 2.625V
电源电压(Max) 2.625 V - -
电源电压(Min) 2.375 V - -
长度 19.0 mm - 19.0 mm
宽度 19 mm - 19.0 mm
封装 BGA-240 BGA BGA-240
厚度 1.76 mm - 1.76 mm
工作温度 -40℃ ~ 85℃ - 0℃ ~ 70℃
产品生命周期 Active Unknown Active
包装方式 Tray Tray Tray
RoHS标准 Non-Compliant Non-Compliant Non-Compliant
含铅标准 Contains Lead Contains Lead Contains Lead
ECCN代码 EAR99 EAR99 -