对比图
型号 IDT72T36135ML6BBG IDT72T36135ML6BBGI IDT72T36135ML5BBG
描述 2.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 362.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 362.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 36
数据手册 ---
制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)
分类 FIFO
安装方式 - - Surface Mount
封装 BGA BGA BGA
封装 BGA BGA BGA
产品生命周期 Active Active Unknown
包装方式 - - Tray
RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant
含铅标准 Lead Free Lead Free Lead Free
ECCN代码 EAR99 - EAR99