对比图
型号 IDT72T36135ML5BBG IDT72T36135ML6BBGI 72T36135ML5BBG
描述 2.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 362.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36位配置524,288 ×36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATIONS 524,288 x 36先进先出 512K X 36 TERASYNC 先进先出
数据手册 ---
制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)
分类 FIFOFIFO
安装方式 Surface Mount - Surface Mount
引脚数 - - 240
封装 BGA BGA PBGA-240
存取时间 - - 10ns, 3.6ns
电源电压 - - 2.375V ~ 2.625V
电源电压(Max) - - 2.625 V
电源电压(Min) - - 2.375 V
长度 - - 19 mm
宽度 - - 19 mm
高度 - - 1.76 mm
封装 BGA BGA PBGA-240
厚度 - - 1.76 mm
工作温度 - - 0℃ ~ 70℃
产品生命周期 Unknown Active Active
包装方式 Tray - Tray
RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant
含铅标准 Lead Free Lead Free Lead Free
ECCN代码 EAR99 - -