LPC18S50FET256,551

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LPC18S50FET256,551概述

32Bit ARM Cortex-M3 flashless MCU with security features; 200KB SRAM; Ethernet, two HS USB, LCD, EMC

Overview

The LPC18S50FET256 is a ARM Cortex-M3 based microcontroller with security features for embedded applications. The ARM Cortex-M3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration.

The LPC18S50FET256 operates at CPU frequencies of up to 180 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.

The LPC18S50FET256 includes 200 kB of on-chip SRAM, security features with AES engine, a quad SPI Flash Interface SPIFI, a State Configurable Timer/PWM SCTimer/PWM subsystem, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals.

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## Features

* Processor core

* ARM Cortex-M3 processor, running at frequencies of up to 180 MHz.

* ARM Cortex-M3 built-in Memory Protection Unit MPU supporting eight regions.

* ARM Cortex-M3 built-in Nested Vectored Interrupt Controller NVIC.

* Non-maskable Interrupt NMI input.

* JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points.

* Enhanced Trace Module ETM and Enhanced Trace Buffer ETB support.

* System tick timer.

* On-chip memory

* 200 kB SRAM for code and data use.

* Multiple SRAM blocks with separate bus access.

* 64 kB ROM containing boot code and on-chip software drivers.

* 64 bit One-Time Programmable OTP memory for general-purpose use.

* Two banks 256 bit total One-Time Programmable OTP memory for AES key storage One bank can store an encrypted key for decoding the boot image.

* AES engine for encryption and decryption of the boot image and data with DMA support and programmable via a ROM-based API.

* Clock generation unit

* Crystal oscillator with an operating range of 1 MHz to 25 MHz.

* 12 MHz internal RC oscillator trimmed to 1.5 % accuracy over temperature and voltage.

* Ultra-low power RTC crystal oscillator.

* Three PLLs allow CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the third PLL can be used as audio PLL.

* Clock output.

* Configurable digital peripherals:

* State Configurable Timer SCTimer/PWM subsystem on AHB.

* Global Input Multiplexer Array GIMA allows to cross-connect multiple inputs and outputs to event driven peripherals like timers, SCTimer/PWM, and ADC0/1.

* Serial interfaces

* Quad SPI Flash Interface SPIFI with 1-, 2-, or 4-bit data at rates of up to 52 MB per second.

* 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time stamping IEEE 1588-2008 v2.

* One High-speed USB 2.0 Host/Device/OTG interface with DMA support and on-chip high-speed PHY USB0.

* One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to an external high-speed PHY USB1.

* USB interface electrical test software included in ROM USB stack.

* Four 550 UARTs with DMA support: one UART with full modem interface; one UART with IrDA interface; three USARTs support UART synchronous mode and a smart card interface conforming to ISO7816 specification.

* Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller excludes operation of all other peripherals connected to the same bus bridge.

* Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA support.

* One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O pins conforming to the full I2C-bus specification. Supports data rates of up to 1 Mbit/s.

* One standard I²C-bus interface with monitor mode and standard I/O pins.

* Two I²S interfaces with DMA support, each with one input and one output.

* Digital peripherals

* External Memory Controller EMC supporting external SRAM, ROM, NOR flash, and SDRAM devices.

* LCD controller with DMA support and a programmable display resolution of up to 1024 H x 768 V. Supports monochrome and color STN panels and TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table CLUT and 16/24-bit direct pixel mapping.

* Secure Digital Input Output SD/MMC card interface.

* Eight-channel General-Purpose DMA controller can access all memories on the AHB and all DMA-capable AHB slaves.

* Up to 164 General-Purpose Input/Output GPIO pins with configurable pull-up/pull-down resistors.

* GPIO registers are located on the AHB for fast access. GPIO ports have DMA support.

* Up to eight GPIO pins can be selected from all GPIO pins as edge and level sensitive interrupt sources.

* Two GPIO group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins.

* Four general-purpose timer/counters with capture and match capabilities.

* One motor control PWM for three-phase motor control.

* One Quadrature Encoder Interface QEI.

* Repetitive Interrupt timer RI timer.

* Windowed watchdog timer.

* Ultra-low power Real-Time Clock RTC on separate power domain with 256 bytes of battery powered backup registers.

* Alarm timer; can be battery powered.

* Analog peripherals

* One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.

* Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s. Up to eight input channels per ADC.

* Unique ID for each device.

* Power

* Single 3.3 V 2.2 V to 3.6 V power supply with on-chip internal voltage regulator for the core supply and the RTC power domain.

* RTC power domain can be powered separately by a 3 V battery supply.

* Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.

* Processor wake-up from Sleep mode via wake-up interrupts from various peripherals.

* Wake-up from Deep-sleep, Power-down, and Deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the RTC power domain.

* Brownout detect with four separate thresholds for interrupt and forced reset.

* Power-On Reset POR.

* Available as 144-pin LQFP packages and as 256-pin, 180-pin, and 100-pin BGA packages.

## Target Applications

* Communication hubs

* Automotive aftermarket

* Power management

* Consumer health devices

* Embedded audio applications

* Industrial control

* Industrial automation

* White goods

## Features

LPC18S50FET256,551中文资料参数规格
技术参数

电源电压DC 2.20V min

针脚数 256

时钟频率 180 MHz

RAM大小 200 KB

位数 32

模数转换数ADC 2

输入/输出数 164 Input

工作温度Max 125 ℃

耗散功率Max 1500 mW

数模转换数DAC 1

电源电压 2.2V ~ 3.6V

电源电压Max 3.6 V

电源电压Min 2.2 V

封装参数

引脚数 256

封装 LBGA-256

外形尺寸

封装 LBGA-256

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Pre-Release

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC版本 2015/12/17

数据手册

在线购买LPC18S50FET256,551
型号: LPC18S50FET256,551
制造商: NXP 恩智浦
描述:32Bit ARM Cortex-M3 flashless MCU with security features; 200KB SRAM; Ethernet, two HS USB, LCD, EMC

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