4mm 11 转密封 250mW TSM 4YJ 系列小尺寸，具备最佳封装密度 专业等级 低触点电阻变化和极好的稳定性 适用于手动和自动操作 完全密封，符合 IP67 汽相和回流焊接 提供覆盖范围Resistive Element | Cermet ---|--- Power Rating | 250mW at 85°C Limiting Element Voltage | 200V linear law Tolerance Standard | ±10% Temperature Coefficient | ±100ppm/°C Contact Resistance Variation | 1% or 3 ohms Electrical Travel | 11 turns ±2 Operating Torque | 1 Ncm max. Rotational Life Electrical & Mechanical | 100 cycles - rated power Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C | | Operating Temperature Range | -55°C to +125°C Dimensions | W. 5.0 D.5.0 H. 3.7mm ### 多转贴片电容器
4mm 11 转密封 250mW TSM 4YJ 系列
小尺寸，具备最佳封装密度
专业等级
低触点变化和极好的稳定性
适用于手动和自动操作
完全密封，符合 IP67
汽相和回流焊接
提供覆盖范围
Resistive Element | Cermet
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Power Rating | 250mW at 85°C
Limiting Element Voltage | 200V linear law
Tolerance Standard | ±10%
Temperature Coefficient | ±100ppm/°C
Contact Resistance Variation | 1% or 3 ohms
Electrical Travel | 11 turns ±2
Operating Torque | 1 Ncm max.
Rotational Life Electrical & Mechanical | 100 cycles - rated power
Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C
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Operating Temperature Range | -55°C to +125°C
Dimensions | W. 5.0 D.5.0 H. 3.7mm